Thermal glue for sale & price in Ethiopia

Thermal Glue

Thermal Glue Circuit Board Adhesive Thermal Conductive Heatsink Viscous Adhesive Glue Compound Glue CPU LED Heat Sink Sealant

Thermal properties, strong glue adhesion.
Specifications: 5g (single)
Melting amount: 0 (200°C/24 Hours)
Evaporation: 0.001% (200°C/24 Hours)
Thermal Conductivity: >0.671W/m-K
Impedance: <0.06
Ging Time: 3min (25°C)
Track Strength: 25Kg
Strength of Connected Buildings: 1.5map
Margin Coefficient: >5.1
Scatter Coefficient: <0.005

Thermal glue is used to bond heat sinks to electronic components like CPUs and LEDs, improving heat dissipation and ensuring stable, efficient cooling.


we are available in all parts of Ethiopia
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